IEC 60115-8-10:2026 – Fixed resistors for use in electronic equipment

IEC 60115-8-10:2026 is a blank detail specification within the IEC 60115 series on fixed resistors for electronic equipment. It covers surface mount (SMD) low-power film resistors of classification level G, intended for assembly on circuit boards in general electronic equipment. This page gives an interpretive overview for testing engineers, procurement specialists and quality managers; readers who need the document itself should obtain it from official IEC sources.

Standard Information

A blank detail specification is a template document: it fixes the structure and the selectable content that a manufacturer or specification writer must complete when describing a particular resistor product. IEC 60115-8-10:2026 applies that template to SMD low-power film resistors classified to level G. Because the classification level is defined at series level, the document works together with the umbrella specifications of the same series rather than standing alone. The record facts are as follows: - Designation: IEC 60115-8-10:2026
- Full title: Fixed resistors for use in electronic equipment - Part 8-10: Blank detail specification: Surface mount (SMD) low-power film resistors for assembly on circuit boards, for general electronic equipment, classification level G
- Status: Current
- Publication date: 2026-09-18
- ICS classification: 31, 31.040, 31.040.10
- Technical committee: TC 40

Scope and Application

The document governs the drafting of detail specifications for surface mount low-power film resistors classified to level G. Classification follows the definition of product classification levels given in the series' general specification, clause 3.4. In practice, this means the blank detail specification supplies the agreed wording, tables and choice points from which a product-specific detail specification is derived, so that resistor descriptions remain comparable across suppliers. Application is limited to SMD low-power film resistors mounted on circuit boards in general electronic equipment. The phrase "general electronic equipment" distinguishes this category from application fields that demand stricter qualification grades; level G therefore marks a defined position within the series' classification ladder. This edition also reflects several technical updates relative to its predecessor within the series. Solderability testing now accommodates both traditional lead-bearing soldering and lead-free soldering, as required. The document supports the provision of detailed visual acceptance criteria. It adds a requirement for visual examination of the primary and proximity packaging. Finally, it allows specific visual acceptance criteria to be applied in addition to those given in Annex B of the sectional specification of the same series.

Products and Materials Covered

The product family in scope is the surface mount low-power film resistor. Such components use a resistive film as the functional element, are packaged in SMD formats, and are soldered directly onto circuit boards without leads through holes. Their low-power rating places them in the signal-conditioning and biasing roles typical of general electronic equipment rather than power conversion. The ICS classification reinforces this placement. Code 31 covers electronics as a whole, 31.040 covers resistors, and 31.040.10 covers fixed resistors specifically. Readers scanning a testing laboratory's scope of accreditation or a procurement specification can therefore use these codes to confirm that a given detail specification for a level G SMD film resistor falls under this document's authority. Materials as such are not specified in the blank detail specification itself; the resistive film technology and construction details are completed in the derived detail specification. What the document fixes is the classification level G, the SMD mounting form, the low-power category and the general-equipment application field.

Testing and Compliance Considerations

For a blank detail specification, laboratory work concentrates on the completed detail specification rather than the blank itself. Engineers select the relevant assessments defined in the series' sectional and general specifications, then record the choices in the detail specification derived from this template. Typical activities include type testing against the chosen requirements, acceptance verification of production lots, and documentation of results in a format that traces each measured property back to the specified clause. Two areas deserve particular attention under this edition. First, solderability assessment must match the assembly process actually used: lead-bearing and lead-free soldering place different demands on termination finishes, so the selected condition should be stated explicitly in test plans and reports. Second, visual acceptance is now addressed in more depth. Examiners should apply the detailed visual criteria provided in the detail specification, plus the packaging inspection requirement for primary and proximity packaging, alongside the baseline criteria of the sectional specification's Annex B. Retest triggers follow normal industry practice: a change in materials, construction or process, a recurring failure mode, or a dispute over results can each justify renewed assessment. Clear documentation of the specification version used for each test round prevents ambiguity when results are compared over time.

Related Standards and Series Context

The designation itself conveys the document's position. The number 60115 identifies the series on fixed resistors for use in electronic equipment. The part number 8-10 shows a two-level structure: part 8 is the sectional level covering a defined resistor technology, and the suffix 10 denotes a blank detail specification within that section. The colon and four-digit year, 2026, mark this as the edition published in that year. A blank detail specification sits at the bottom of the typical hierarchy of resistor documents: a general specification defines shared definitions and classification levels, a sectional specification groups requirements for one technology, and blank detail specifications provide templates for product-specific documents. This document is intended to be completed jointly by component manufacturers and users, so that the resulting detail specification reflects agreed requirements rather than unilateral declarations. Readers should verify at the point of use that the edition referenced in their contracts matches this 2026 publication.